TSMC claims it is delivering the first EUV chips to market with its N7+ process. Q2 2019 may also be a strong quarter for TSMC if Android manufacturers ramp their own orders on the new node.Subscribe Today to get the latest ExtremeTech news delivered right to your inbox.TSMC is reportedly on track for improved 7nm utilization in 2019, following several months of lower-than-expected order volume. Two versions of the process will be developed: a low power version for mobile applications. It delivers a 15% increase in density compared to N7 and has reached similar yield levels. Samsung will use EUVL for their 7nm node and thus will be the first to introduce this new technology after more than a decade of development.On May 24 2017, Samsung released a press release of their updated roadmap. Due to delays in the introduction of EUVL, Samsung will introduce a new process called 8nm LPP, to bridge the gap between 10nm and 7nm. It’s not "just" TSMC’s first process that uses the long-awaited extreme ultraviolet (EUV) lithography, TSMC also claims that N7+ is the industry’s first commercially available EUV process. The news would be welcome for the foundry given that it’s been struck by multiple issues in the past six months, including malware infections, the contamination of foundry processing chemicals that destroyed a significant number of wafers, and lower-than-expected manufacturing volumes thanks to Apple’s unit volume declines. This means that SMIC has become the third chip company in the world to master processes below 10 nanometers. For more information about TSMC please visit http://www.tsmc.com.The web-based portal for smarter supplier interactions TSMC announced that it's bringing its N7+ EUV process node to the market in high volume, and it bears the distinction of being the first commercially available 7nm, EUV-based process technology. EUV technology enables TSMC to keep driving chip scaling as the shorter wavelength of EUV light is better able to print the nanometer-scale features of advanced technology designs. The N7+ process with EUV technology is built on TSMC’s successful 7nm node and paves the way for 6nm and more advanced technologies. The company also says it has been able to match yields to the original 7nm process that has been in production for over a year.
TSMC has already begun volume production of its 7nm EUV node according to the same sources. Q2 2019 may also be a strong quarter for TSMC if Android manufacturers ramp their own orders on the new node.Subscribe Today to get the latest ExtremeTech news delivered right to your inbox.TSMC is reportedly on track for improved 7nm utilization in 2019, following several months of lower-than-expected order volume. TSMC is the first foundry to provide 7-nanometer production capabilities, and is headquartered in Hsinchu, Taiwan. GlobalFoundries claims a 2.8 times density improvement compared to their 14nm process, and a performance improvement of 40% or a 55% reduction in power consumption. Since the process has been confirmed to be TSMC 7nm EUV for the high-end lineup, we can assume some truly phenomenal performance leaps. TSMC has already begun volume production of its 7nm EUV node according to the same sources. The second-generation 7 nm from TSMC (CLN7FF+) will use EUV for select layers and will require developers to redesign EUV layers according to more aggressive rules. The process will be manufactured without the use of EUVL and will feature a slightly relaxed transistor size.The 7nm process features SAQP for the FEOL, and double patterning for the BEOL. Apple is expected to dominate TSMC’s 7nm orders in Q3 due to the next iPhone ramp, so Qualcomm and MediaTek are reportedly watching their own ramps carefully. The company’s N7P and N5P technologies … TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process. TSMC's 7nm+ EUV is in production, improves performance by 10% 7nm will be everywhere by the end of the year By Isaiah Mayersen on May 26, 2019, 12:15 9 comments Such a delay after already significantly reducing its 7nm scaling targets and using EUV (which TSMC is currently using to make 5nm iPhone 12 A14 chips with), raises many questions yet …